このサイトはJavaScriptがオンになっていないと正常に表示されません

+81-3-5645-2021

9:00-18:00 (except for Saturday, Sunday and Holidays)

Font size
  • Small
  • Medium
  • Large
日本語 中文

For substrate sealant (heat dissipation)

As the performance of electronic components is getting higher and higher, heat productivity is increased. Therefore, it is required to dissipate heat through the heating body so that the electronic components can be stably used. Our company equips the thermosetting resin with heat conductivity. We can offer a variety of products with superior electrical characteristics, mechanical properties, adhesion, heat resistance, moisture resistance, etc.

Notifications List

Product name Main application example Feature Resin
VX-3528 Large module High heat conductivity, low shrinkage, flame-retardant Epoxy
VX-3386 LED driver High heat conductivity, low linear expansion Epoxy
ER-6761 Large module Heat dissipation, High Tg, low linear expansion Epoxy
VX-3329 LED driver Heat conductivity, low linear expansion, capable of curing at ambient temperature Epoxy

TOP