For substrate sealant (heat dissipation)
As the performance of electronic components is getting higher and higher, heat productivity is increased. Therefore, it is required to dissipate heat through the heating body so that the electronic components can be stably used. Our company equips the thermosetting resin with heat conductivity. We can offer a variety of products with superior electrical characteristics, mechanical properties, adhesion, heat resistance, moisture resistance, etc.
|Product name||Main application example||Feature||Resin|
|VX-3528||Large module||High heat conductivity, low shrinkage, flame-retardant||Epoxy|
|VX-3386||LED driver||High heat conductivity, low linear expansion||Epoxy|
|ER-6761||Large module||Heat dissipation, High Tg, low linear expansion||Epoxy|
|VX-3329||LED driver||Heat conductivity, low linear expansion, capable of curing at ambient temperature||Epoxy|