Announcement of conference presentation “International Conference on Electronics Packaging (ICEP)”

At the International Conference on Electronics Packaging (ICEP) hosted by the Japan Institute of Electronics Packaging (JIEP), we gave an invited lecture titled “A Liquid Epoxy Encapsulant With Excellent Weather Resistance, Long-Term Reliability and Casting Properties” and were awarded a certificate from the conference. In this lecture, we introduced the features of our advanced epoxy encapsulant technology and the results of its long-term reliability evaluation. We will continue to provide high-quality products using our accumulated compounding design technology and contribute to the realization of a better future. 

Title: 2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025) 

Date: 2025.4.15-19 (4 days) 

Content: A Liquid Epoxy Encapsulant With Excellent Weather Resistance, Long-Term Reliability and Casting Properties 

[About the Japan Institute of Electronics Packaging (JIEP)] 

The Japan Institute of Electronics Packaging (JIEP) is one of the largest academic societies in Japan that deals with electronics packaging technology and was established in 1998 through the merger of the former “Hybrid Microelectronics Association” and the former “Printed Circuits Society.” We have formed a community of approximately 2,400 researchers and engineers working at the forefront of industry and academia in packaging technology, a core technology in Japan’s electronics industry, and are contributing to the development of research and development and the training of engineers.