High heat-resistant, thermal shock resistant sealing material
In order to meet the high heat resistance requirements of sealing resins centering on the use of SiC and GaN power modules due to the expansion of demand for power semiconductors in recent years, a sealing material with a long-term heat resistance has been developed.
Its heat cycle, continuous heat resistance, and low flexibility are excellent, contributing to the improvement in reliability of power modules.
|Product name||Main application example||Feature||Resin|
|HTG-7-221||Power module||High heat-resistant, flame-retardant||Epoxy|