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+81-3-5645-2021

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For electronic component sealant (heatproof, waterproof, insulating and flame retardance)

Mainly for control substrate casting and sealing sensor module  applications, we have wide range of products with excellent electrical characteristics, mechanical characteristics, adhesion, heat resistance, moisture resistance, chemical resistance, etc. according to customer needs. Our products are widely used in a variety of fields.

  

 

Notifications List

Product name Material Characteristics Application
U-7605A/B
  • Casting materials
  • Urethane
  • Flame retardant
  • Flexibility
  • Heat shock resistance
  • Heat resistance
  • High flow
  • Water resistance
  • Insulating properties
  • RoHS
  • Precision mechanical parts 
  • Base encapsulation
  • Sensor encapsulation
U-331A/B
  • Casting materials
  • Urethane
  • Heat shock resistance
  • High flow
  • Low viscosity
  • Curing at room temperature
  • Water resistance
  • Insulating properties
  • Adhesion
  • RoHS
  • Flexibility
  • Sensor encapsulation
  • Precision mechanical parts 
  • Base encapsulation
VX-8760A/B
  • Epoxy
  • Dip material
  • Hardness
  • Heat shock resistance
  • Water resistance
  • Insulating properties
  • Thixotropy
  • RoHS
  • Electronic component encapsulation
  • Sensor encapsulation
SR-25/SH-25
  • Epoxy
  • Casting materials
  • Water resistance
  • Insulating properties
  • Adhesion
  • RoHS
  • Flame retardant
  • Hardness
  • Heat resistance
  • High flow
  • Base encapsulation
  • Encapsulation of film capacitors
  • Sensor encapsulation
  • Coil encapsulation
  • Electronic component encapsulation
U-380A/B
  • Urethane
  • Casting materials
  • Flame retardant
  • Hardness
  • High flow
  • Low viscosity
  • Insulating properties
  • RoHS
  • Precision mechanical parts 
  • Encapsulation of film capacitors
U-365A/B
  • Urethane
  • Casting materials
  • Flame retardant
  • Flexibility
  • Heat resistance
  • High flow
  • Low viscosity
  • Curing at room temperature
  • Insulating properties
  • RoHS
  • Base encapsulation
  • Encapsulation of film capacitors
  • Sensor encapsulation
  • Precision mechanical parts 

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