This paper will be presented at the “2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference” held from April 15 to 19, 2025.

This paper will be presented at the “2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025)” held in Nagano City, Nagano Prefecture from April 15 to 19, 2025. 

[Content] 

A Liquid Epoxy Encapsulant With Excellent Weather Resistance, Long-Term Reliability and Casting Properties 

[Date and Time] 

Wednesday, April 16, 2025, 11:20 –Room D (WD2: Polymer Materials)