We will exhibit at the “2026 International Conference on Electronics Packaging (ICEP)” from April 14 to 18, 2026

Our company will participate as a Gold Sponsor and exhibit a booth at the 2026 International Conference on Electronics Packaging (ICEP), to be held in Hiroshima from April 14 to 18.
ICEP is one of the largest academic conferences in Japan dedicated to electronics packaging technology, a core technology supporting the nation’s semiconductor industry.
At our booth, we will showcase the features of our advanced epoxy encapsulation technologies and introduce our high‑quality product designs enabled by our accumulated formulation expertise.