Exhibition Report: Participation in NEPCON JAPAN Autumn 2025 – Electronics Development & Manufacturing Expo

We exhibited at the 4th NEPCON JAPAN [Autumn] – Electronics Development & Manufacturing Expo, held at Makuhari Messe from September 17 (Wed) to 19 (Fri), 2025.

Over the three-day period, the event welcomed approximately 30,000 visitors, and our booth received 365 groups of guests.

We sincerely thank everyone who visited our booth. We will continue striving to provide even better products and services.

■ Exhibition Overview

• Exhibition Name: 4th NEPCON JAPAN [Autumn] – Electronics Development & Manufacturing Expo
• Dates: September 17 (Wed) – September 19 (Fri), 2025
• Venue: Makuhari Messe (2-1 Nakase, Mihama-ku, Chiba-shi, Chiba 261-8550, Japan)
• Booth Number: 7-37

■ Featured Exhibit Panels

• Eco-Friendly Epoxy Encapsulation Material (Halogen-Free / Antimony-Free)
  Achieves high flame retardancy (UL94 V-0) without using halogen, antimony-based flame retardants, or phosphorus-based flame retardants. Ideal for automotive and industrial equipment applications, especially in response to the recent surge in antimony prices.
• High-Filler Magnetic Epoxy Resin Compound
  High-Fill Magnetic Filler Type. Combines high permeability and moldability for use in inductors and transformer core components. Suitable for molding magnetic materials.
• Low-Temperature, Low-Pressure Molded Epoxy Resin Compound
  Enables molding at low temperature and pressure, reducing damage to mounted components on circuit boards. Ideal for caseless board encapsulation.

■ Upcoming Exhibition

• Exhibition Name: Automotive World 2026 – 18th Automotive Electronics Technology Expo
• Dates: January 21 (Wed) – January 23 (Fri), 2026
• Venue: Tokyo Big Sight (Tokyo International Exhibition Center)

■ Contact Us

For advance meeting reservations or technical consultations, please contact us via the link below:
👉 [Contact Form]