Find products to your needs liquid mixed material
to improve the heat dissipation of modules and devices
Product name |
Main application example |
Feature |
Resin |
U-659A/B |
Automotive substrate sealing, large substrate sealing |
Heat cycle, low Tg |
Urethane |
U-640A/B |
Automotive substrate sealing, large substrate sealing |
Heat cycle, low Tg |
Urethane |
VX-3528A/B |
Large module |
High heat conductivity, low shrinkage, flame-retardant |
Epoxy |
ER-6506FA/B |
Automotive substrate sealing, large substrate sealing |
Heat cycle, high fluidity |
Epoxy |
ER-6662FA/B |
Automotive substrate sealing, large substrate sealing |
Heat cycle |
Epoxy |
U-638A/B |
Automotive substrate sealing, large substrate sealing |
Heat cycle, low Tg |
Urethane |
ER-6700FA/B |
Large module |
Heat dissipation, High Tg, low linear expansion |
Epoxy |
VX-3329A-2/B-2 |
LED driver |
Heat conductivity, low linear expansion, capable of curing at ambient temperature |
Epoxy |