Product information - High-performance resin material manufacturer Nihon Gosei Kako Co., Ltd.

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Product name	Material	Characteristics	Application
TM-250	Molding materials Epoxy	RoHS Flame retardant Hardness High flow Water resistance Insulating properties Low linear expansion Low Shrinkage	Precision parts molding
U-640A/B	Urethane Casting materials	Low viscosity Water resistance Insulating properties RoHS Low temperature molding Flame retardant Flexibility Heat shock resistance	Precision mechanical parts Sensor encapsulation Coil encapsulation Base resin
ER-5061FA/B	Epoxy Casting materials	High flow Water resistance Insulating properties Adhesion RoHS Flame retardant Hardness Heat resistance	Precision mechanical parts Base encapsulation Sensor encapsulation Coil encapsulation
VX-8740A/B	Casting materials Epoxy	Hardness Curing at room temperature Insulating properties Adhesion RoHS
OR-29	Molding materials Epoxy	High flow RoHS Magnetic Hardness Heat resistance	Magnetic materials Coil encapsulation Compression Transfer
U-7605A/B	Urethane Casting materials	Insulating properties RoHS Flame retardant Flexibility Heat shock resistance Heat resistance High flow Water resistance	Precision mechanical parts Base encapsulation Sensor encapsulation
VX-3528A/B	Epoxy Casting materials	Low Shrinkage Low elasticity RoHS Flame retardant Hardness Heat shock resistance Heat resistance Water resistance Thermal conductivity Insulating properties Low linear expansion	Base encapsulation Power module encapsulation Sensor encapsulation Coil encapsulation Electronic component encapsulation
ER-6506FA/B	Epoxy Casting materials	Insulating properties RoHS Flame retardant Flexibility Heat shock resistance High flow Water resistance	Base encapsulation Sensor encapsulation Coil encapsulation
U-331A/B	Urethane Casting materials	Flexibility Heat shock resistance High flow Low viscosity Curing at room temperature Water resistance Insulating properties Adhesion RoHS	Precision mechanical parts Base encapsulation Sensor encapsulation
ER-3681FA/B	Casting materials Epoxy	Heat resistance High flow Water resistance Insulating properties Low linear expansion Low Shrinkage High strength RoHS Flame retardant Hardness Heat shock resistance	Coil encapsulation Electronic component encapsulation Base encapsulation Power module encapsulation Sensor encapsulation